Job Description:
Equal Employment Opportunity/M/F/disability/protected veteran status

Location: Rochester, NY Category: Engineering Posted On: Tue Dec 31 2024 Job Description:

Job Description for Semiconductor Packaging Engineer

JOB SUMMARY

AIM Photonics is looking for a Semiconductor Packaging Engineer who will be hands-on working with advanced solder interconnect equipment and materials for the assembly of optoelectronic packages.

AIM Photonics is one of nine United States Department of Defense Manufacturing Innovation Institutes which are industry-driven, public-private partnerships that focus the nation's premiere capabilities and expertise to capture critical global manufacturing leadership. AIM Photonics is headquartered at NY CREATEES in Albany, NY. The AIM Photonics Test Assembly and Packaging facility (TAP) is new state of the art electronic photonic packaging facility in Rochester, NY. Photonics is an exciting area which is crucial for fast data demands by everyone. Photonic packaging is 90% of the cost of photonic products and can be a differentiator in the success of the final product.

Job responsibilities include but are not limited to:

• Develop interconnect processes and build heterogeneously integrated electronic and optoelectronic packages using state of the art equipment at TAP.
• Run DOE experiments to find best machine parameters to achieve successful builds of advanced packages such as processes including flip chip, solder attach, plasma cleaning, thermal compression bonding, additive printing, and dispensing.
• Evaluate and qualify materials including solders used in electronic and optoelectronic packages as required by customers application.
• Work with high precision equipment to build parts with good solder interconnect integrity and reliability.
• Perform continuous inspection, characterization, and metrology of a process to make sure process is robust. Serve as liaison with marketing, vendors, purchasing, and customer on technical information.
• Interpret failure analysis reports and cross-sections to understand solder joint integrity.
• Gather and analyze data; conduct root cause and failure mode analysis to efficiently improve yields and device performance.

Job Requirements:

Minimum Requirements for Semiconductor Packaging Engineer

• Bachelor's degree in Mechanical Engineering, Materials Science, Engineering Physics, or equivalent.
• 10+ years' experience in fabrication, packaging, or manufacturing of semiconductor devices.
• Experience with active and passive optical component alignment.
• Experience with UV cured epoxies and epoxy reliability.

This position is contingent on the satisfactory completion of a background check; this position may require annual background checks.

PREFERRED REQUIREMENTS

• Masters/PhD in related engineering science.
• Strong understanding of engineering and materials science fundamentals and a demonstrated aptitude to learn.
• Experience in cleanroom, high precision equipment, inspection, and characterization equipment in semiconductor assembly line.
• Experience in back-end assembly process including flip-chip bumping, thermal compression bonding, and solder reflow will be highly desirable.
• Experience with flux and fluxless soldering of eutectic solder alloys and intermetallic formation.
• Experience with failure analysis of solder joints.
• Strict discipline to follow rules, specifications, have good attention to details as well as have good organization skills.
• DOE Experience is a plus.
• Excellent oral and written communication skills.

Don't meet every requirement? At NY CREATES we are dedicated to building a welcoming, diverse and inclusive workplace. If you are excited about working for NY CREATES but your experience doesn't exactly align perfectly with the job description, we encourage you to apply anyway, you might still be a perfect fit or a fit for another role at NY CREATES.

Benefits

• Medical, Vision, and Dental
• Competitive Pay and PTO
• Flexible Heath Spending and Dependent Care Accounts
• Basic / Optional Life Insurance
• Post-Retirement Health Insurance
• Employer contribution of 7% of earnings to a Basic Retirement plan after meeting one year of service.
• Optional employee contributed retirement account.

Location: Rochester, NY

Salary Range: $150,000-$180,000

*Posted salary rates are determined upon experience and education

Additional Information:

NOTE: Some positions require access to export-controlled commodities, technical data, technology, software, or restricted programs where U.S. Government authorization may be required.

For positions requiring such access, offers of employment are contingent upon the employer being able to obtain the necessary authorization, including, if required, an export license from the U.S. Department of Commerce's Bureau of Industry and Security, the U.S. Department of State's Directorate of Defense Trade Controls, or other government agencies. The decision to pursue an export license application is at The Research Foundation for SUNY's sole discretion. Proof of status may be required prior to employment in connection with necessary authorizations.

Employment is with the Research Foundation for SUNY which is an Equal opportunity Employer including individuals with disabilities and protected veterans.

In compliance with the Americans with Disabilities Act (ADA), if you have a disability and require a reasonable accommodation to apply please call Human Resources at 518-437-8686.

PI258997015

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